Pingxiang Lianjin Cheng Technology Co., Ltd

In Power PCB (Printed Circuit Board) manufacturing, when the dielectric layer thickness of a power board is less than 0.4mm, using three prepreg (PP) sheets instead of a single or double layer is often necessary due to several critical factors related to reliability, manufacturability, and electrical performance. Here are the detailed reasons: 1. Process Reliability & Uniformity Thinner PP Sheets = Better Control: A single thick PP layer (e.g., 0.4mm) may have inconsistent resin flow during lamination, leading to voids or weak spots. Using three thinner PP sheets (e.g., 3 × 0.13mm ≈ 0.39mm) improves resin distribution and minimizes thickness variation. Avoids Resin-Starved Areas: Multiple layers help ensure uniform resin filling between copper layers, preventing dry spots that could cause delamination or reduced dielectric strength. 2. Electrical Insulation & High-Voltage Requirements Breakdown Voltage Safety: Power boards handle high voltages, and dielectric thickness directly impacts insulation. Three PP layers reduce the risk of micro-voids or defects that could create weak insulation paths. Electric Field Distribution: Multiple layers distribute the electric field more evenly, reducing the chance of partial discharge or arcing in high-voltage applications. 3. Mechanical Strength & Delamination Resistance Stress Distribution: Thin dielectric layers are prone to cracking under thermal or mechanical stress. Three PP layers provide better stress absorption and reduce the risk of micro-cracks. Improved Bonding: More PP layers enhance interlayer adhesion, preventing delamination during thermal cycling (e.g., reflow soldering or power cycling). 4. Manufacturing Process Optimization Controlled Resin Flow: During lamination, thinner PP sheets allow more precise control over resin flow, preventing excessive bleeding or insufficient bonding. Compatibility with Core Thickness: Ultra-thin cores (e.g., 0.1mm) require multiple PP layers to ensure proper filling and avoid resin starvation near copper features. 5. Signal Integrity & Thermal Management Consistent Dielectric Properties: Multiple PP layers help maintain uniform dielectric constant (Dk) and loss tangent (Df), crucial for high-frequency power integrity. Thermal Conductivity: Stacking PP layers can improve heat dissipation by creating a more homogeneous thermal path.   How to identify the PPs quantity? Actually, we can do microsction for PCB board, it can be identify the quantity of PPs, we can check if the stackup meets our requirement. Conclusion Using three PP sheets for sub-0.4mm dielectric layers in power PCBs ensures:✔ Better process yield (fewer voids/delamination)✔ Higher voltage reliability (reduced insulation risks)✔ Stronger mechanical structure (resists cracking)✔ Controlled manufacturing (resin flow, bonding quality) This approach is common in high-reliability applications like server power supplies, automotive electronics, and industrial PCBs. The exact number of PP layers may vary based on material specs (e.g., resin content, glass weave) and lamination parameters.  When you need any support, Golden Triangle group will provide the professional service and support to you

Advantages and Disadvantages of Aluminum PCB Aluminum boards are one of the most thermally conductive PCB options. They keep as much heat away from vital components as possible to ensure minimal circuit damage. Thanks to their high heat tolerance, they can handle higher density circuits and larger power levels. Substrates created from aluminum alloys have a high level of physical durability that lowers the risk of breakage. Compared to other metals, aluminum has a lower environmental impact in addition to a reasonable cost. On the other hand, aluminum PCBs tend to have more niche uses than standard boards. While they cost less than adding conductors to a copper board, they have a higher price than standard PCBs without those components. Investing in an aluminum core may not pay off if your application doesn’t involve high temperatures. If you plan on creating a flex circuit, an aluminum flex PCB can only flex into its initial position. It will bend to fit into smaller electronics, but it won’t withstand the stress of vibration. Advantages Disadvantages Low Cost: Aluminum is a metal that can be found in a variety of climates, so it is easy to mine and refine. Therefore, the costs of doing so are significantly lower than other metals. In turn, this means that manufacturing products with these metals are less expensive as well. High cost. Environmentally Friendly: Aluminum is non-toxic and recyclable. Manufacturing with aluminum is also conducive to conserving energy due to its ease of assembly. For printed circuit board suppliers, using this metal helps maintain the health of our planet. The current mainstream can only do single aluminum PCB, it is difficult to do double sided aluminum PCB. Heat Dissipation: High temperatures can cause severe damage to electronics, so it is wise to use a material that can help dissipate heat. Aluminum can actually transfer heat away from vital components, thus minimizing the harmful effect it could have on the circuit board. The product will be more easily to have matter in electrical strength and pressure. Higher Durability: Aluminum provides strength and durability to a product that ceramic or fiberglass bases cannot. Aluminum is a sturdy base material that can reduce accidental breakage during manufacturing, handling, and everyday use. Aluminum is susceptible to more rapid attacks by halide ions, of which chloride (CL -) is the most frequently encountered. Lightweight: For its incredible durability, aluminum is a surprisingly lightweight metal. Aluminum adds strength and resilience without adding on any additional weight. Performance of Aluminum PCB:  1.  Thermal Dissipation Common PCB substrates, such as FR4, CEM3 are poor conductors of thermal. If the heat of electronic equipments cannot be distributed in time, it will result in high temperature failure of electronic components. Aluminum substrates can solve this thermal dissipation problem. 2.  Thermal Expansion Aluminum substrate PCB can effectively solve the thermal dissipation problem, so that the thermal expansion and contraction problem of components on printed circuit boards with different substances can be alleviated, which improves the durability and reliability of whole machine and electronic equipments. In particular, aluminum substrate can solve the SMT (surface mount technology) thermal expansion and contraction problems. 3.  Dimensional Stability Aluminum substrate printed circuit board has apparently higher stability than the insulating material of the printed circuit board. When heated from 30 ° C to 140 ~ 150 ° C, the dimensional change of aluminum substrate is only 2.5 ~ 3.0%. 4.  Other Performance Aluminum substrate printed circuit board has shielding effect, and can alternative brittle ceramic substrate. Aluminum substrate also helps to improve the heat resistance and physical properties and reduce production costs and labor.