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4L Rigid Flexible Printed Circuit Board ENIG HASL Finished 4mil
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xProduct Details
| PCB Layer | 4L Flexible Printed Circuit Board | Material | PI |
|---|---|---|---|
| Board Layer | 4L | Finished Treatment | ENIG |
| Copper Thickness | 1/1/1/1oz | Minimum Drilling Size | 0.1mm |
| High Light | 4mil Flexible Printed Circuit Board,ENIG HASL Flexible Printed Circuit Board,ENIG HASL flex pcb prototype |
||
Product Description
4L Rigid Flexible Printed Circuit Board ENIG HASL Finished 4mil
Flex PCB Board 4L Flexible Printed Circuit Board PCBA Supplier PCBA Printed Circuit Board Assembly
4L Flexible Printed Circuit Board
Flexible printed circuits are circuit boards that have the ability to bend or twist. From this assertion, it is obvious that they are distinguished by a flexible construction. That is why electronic engineers and designers use them in applications that demand for their qualities. They are also referred to as flex circuits and are mostly used in small electronic applications. Since they are characterized by their ability to bend, flexible printed circuits are made of flexible substrate such as polyimide. Another important quality of flexible printed circuits is that they have superior heat dissipation than printed circuit boards. It is this quality that makes it possible for the electronics that use it to stay in quality condition for a long time.
HSX products cover 1~32L FR-4 PCB, IMS PCB,HDI Boards, high frequency PTFE boards and Rigid-flex boards etc. It provides flexible quick turn production services (12 hours to72 hours), as well as small volume to big volume PCB manufacturing.Products are widely used in high-tech fields such as communications, power supplies, computer networks, digital products, industrial control, science and education, medical devices, and aerospace.
| FPC Technology Capability | |||
| Attribute (All dimensions are mils unless otherwise specified) |
Mass Production (Yield≥ 80%,Cpk≥1.33) |
Small Amount(Yield≥60%, Key Specification Yield≥80% |
Sample |
| FPC(yes/no) | yes | yes | yes |
| Layer count/Structure, Max. | 2 | 4 | 6 |
| Size(L×W), Max. | 550mm*250mm | 550mm*250mm | 700mm*250mm |
| Nominal thickness (mm) | 0.1~0.5 | 0.1~0.5 | 0.1~0.8 |
| Thickness tolerance | ±10%(>0.3mm)/±0.03mm(≤0.3mm) | ±10%(>0.3mm)/±0.03mm(≤0.3mm) | ±10%(>0.3mm)/±0.03mm(≤0.3mm) |
| Surface finish type | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold | ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold |
| Soft ENIG(yes/no) | no | no | no |
| Base material type | PI | PI | PILCPTK |
| Coverlay thickness (um) | 28/50/60/80 | 28/50/60/80 | 28/50/60/80 |
| Adhesive thickness (um) | 25/40/50/65 | 25/40/50/65 | 25/40/50/65 |
| Copper thickness, Min./Max. (um) | 12-70 | 12-70 | 12-70 |
| Base material thickness, Min./Max. (um) | 25-75 | 25-75 | 25-100 |
| Mechanical drilled thru-hole size (DHS), Min. | 0.15 | 0.15 | 0.15 |
| Plating aspect ratio, Max. | 3:1 | 3:1 | 5:1 |
| Pad size, Min. | With through hole:0.4mm Without through hole:0.2mm |
With through hole:0.4mm Without through hole:0.2mm |
With through hole:0.3mm Without through hole:0.2mm |
| Pad size tolerance | 20% | 20% | 10% |
| Pad to pad space, Min. | 4mil | 4mil | 4mil |
| Pad to outline tolerance | ±3mil | ±3mil | ±2mil |
| Pattern location accurancy | ±3mil | ±3mil | ±2mil |
| Pattern location accurancy from top side to bottom | ±3mil | ±3mil | ±2mil |
| Laser via hole diameter/pad, Min. | 4/12mil | 4/10mil | 4/10mil |
| Outerlayer(Hoz+plating) line width/space, Min. | 3/3mil | 3/3mil | 2/2mil |
| Innerlayer(Hoz) line width/space, Min. | 3/3mil | 3/3mil | 2/2mil |
| Inner line width tolerance | ±10% | ±10% | ±10% |
| Outerlayer registration, Min. (Pad diameter = DHS + X) | DHS + 8 | DHS + 8 | DHS + 6 |
| Innerlayer registration, Min. (Pad diameter = DHS + X)(L≤4 layer) | DHS + 10 | DHS + 10 | DHS + 8 |
| Laser via hole pitch, Min. | 0.40mm | 0.40mm | 0.35mm |
| Mechanical hole pitch, Min. | 0.50mm | 0.50mm | 0.40mm |
| Drilled hole position tolerance | ±2mil | ±2mil | ±2mil |
| Hole size tolerance | ±2mil | ±2mil | ±2mil |
| Location accurancy from tooling hole(PTH&NPTH) to pad | ±3mil | ±3mil | ±2mil |
| Location accurancy from tooling hole(PTH&NPTH) to outline | ±3mil | ±3mil | ±2mil |
| Outline size tolerance | ±2mil | ±2mil | ±2mil |
| LPI registration/dam, Min. | 2mil/4mil | 2mil/4mil | 2mil/3mil |
| LPI dam on CVL | 8mil | 8mil | 8mil |
| Coverlay open window/dam | Φ0.5mm/0.3mm | Φ0.5mm/0.3mm | Φ0.3mm/0.2mm |
| Coverlay registration/Resin flow | 4mil | 4mil | 2mil |
| Stifferness material | FR4/PI/Steel | FR4/PI/Steel | FR4/PI/Steel |
| Stifferness dam, Min. | 12mil | 12mil | 8mil |
| Stifferness registration/Resin flow | 8mil/4mil | 8mil/4mil | 4mil/2mil |
| Impedance tolerance | 10% | 10% | 5% |
| Thermal reliability(LPI, FCCL, CVL) | 288°/10s/3times | 288°/10s/3times | 288°/10s/3times |
| Qualified material and structure UL | PI | PI | PI |
FAQ:
1. What service can you provide?
Printed Circuit board, Printed Circuit Assembly, Rapid Prototype order
2. How fast is your lead time?
HDI board fastest 3 WDs, 2L and 4L Rigid board fastest 24H
3. How to get quick quotation?
Please provide gerber file and details of the board(including layer, board thickness, copper thickness, surface treatment, solder mask and silkscreen color, special request if any, demand quantity, etc)
Sample list:
| PCB Layer | 4L |
| PCB surface | ENIG |
| PCB material | FR4, TG135 |
| finished Copper thickness | 2/2/2/2oz |
| solder mask color | Double side, red |
| Silkscreen | Double side, black |
| Quantity | 1000pcs, 2 weeks |
4.What payment terms do you accept?
A: Wire Transfer(T/T) or Letter of Credit(L/C) or Paypal(only for small value less than 500usd)
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