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4L Immersion Gold Communication PCB Assembly 1oz Copper Thickness
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xProduct Details
| Number Of Floors | 4L | Board Thickness | 1.0mm |
|---|---|---|---|
| Copper Thickness | 1oz | Surface Treatment | Immersion Gold |
| Line Width And Space | 0.10mil / 0.127mil | ||
| High Light | Immersion Gold Communication PCB,1oz Copper Communication PCB,0.127mil Multi Layer PCB Assembly |
||
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| Items | Standard | Advanced | |
|---|---|---|---|
| Fr4 max. layers. count | 1~24 | 26~36 | |
| HDI max. layers. count | 4~20L (3+N+3) | 22~32 (3+N+3) | |
| D/S(NPTH) max. panel size | 21.5*24.5"(546*622mm) | 21.5*59"(546*1500mm) | |
| S/S(NPTH) max. panel size | 21.5*24.5"(546*622mm) | 21.5*49"(546*1245mm) | |
| multilayer max. panel size | 21.5*24.5"(546*622mm) | 21.5*49"(546*1245mm) | |
| min. piece size | 5*5mm | 2*2mm | |
| max. overall board thickness | 158mil (4mm) | 394mil (10mm) | |
| Min. Overall Board or Core Thickness | 8mil (0.200mm) | 3mil (0.075mm) | |
| ≤ 1.0mm PCB`s Boards Thickness Tolerance | ±3mil (0.075mm) | / | |
| ≤ 2.0 mm PCB`s Boards Thickness Tolerance | ±5mil (0.13mm) | / | |
| Max. Aspect Ratio | 15:01 | / | |
| FR-4 Min. DHS (Drill Hole Size) | 6mil (0.15mm) | / | |
| HDI Min. DHS (Drill Hole Size) | 0.08-0.10MM | / | |
| Min. Hole to Hole Distance | 10mil (0.25mm) | 6mil (0.150mm) | |
| PTH Hole Size Tolerance | ±3mil (0.076mm) | ±2mil (0.050mm) | |
| NPTH Hole Size Tolerance | ±2mil (0.050mm) | ±1.5mil (0.040mm) | |
| Hole Location Tolerance | ±3mil (0.076mm) | ±2mil (0.050mm) | |
| Min. Line Width/Space---Inner Layer---1/3 oz | 2.5/2.5mil (0.0635/0.0635mm) | 2/2mil (0.0508/0.0508mm) | |
| Min. Line Width/Space---Inner Layer---1oz | 4/4mil (0.100/0.100mm) | 3.0/3.0mil (0.089/0.089mm) | |
| Min. Line Width/Space---Outer Layer---Hoz+Plating | 4/4mil (0.100/0.100mm) | 3.5/3.5mil (0.089/0.089mm) | |
| Min. Line Width/Space---Outer Layer---1oz+Plating | 5/5mil (0.127/0.127mm) | 4/4mil (0.100/0.100mm) | |
| Min. Line Width/Space---Outer Layer---2oz+Plating | 6/6mil (0.150/0.150mm) | 5/5mil (0.127/0.127mm) |
Product Description
4L Immersion Gold Communication PCB Assembly 1oz Copper Thickness
4L, Immersion gold,Communication PCB, ISO9001, UL Approved Shenzhen Factory
Communication terminal PCB
Multilayer PCB/4L Board
The max layers is 32layer,needs to review if ≥20 layer.
The max finish panel size is 740* 500 MM, but if >600 MM, needs to review the board at first.
The Minimum panel size is 5 * 5mm.
PCB raw materials include PI +FR4,FR4, Rogers,Halogen-free, High TG materials and so on.
PCB thickness capability is from 0.2~4.0mm, if thickness less than 0.2 mm, or more than 4 mm, will needs to review.
PCB copper thickness capability is H~5oz. If more than 5oz, will need to review.
Bow and twist tolerance is 0.075%.
The minimum hole size is 0.15mm, if drilling size less than 0.15mm, will need to confirm.
The max hole size is 6.0mm, if hole size more than 6mm, will need to use milling to enlarge holes.
Min space in inner layer(one-sided): 4～8L(include): sample: 4 mil; small volume: 4.5 mil;
8~12L(include): sample: 5 mil; small volume: 5.5 mil
12～18L(include): sample: 6 mil; small volume: 6.5 mil
PCB solder mask Color: Green, Matt green,Blue, Matt blue, Black, Matt black, Yellow, Red, White,etc
PCB silkscreen color: White, Black, etc
PCB surface: HASL lead free, ENIG, Immersion Sn, OSP, Selective ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger,etc.
Application: Communications, Industry/comsumer Electronic.
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